Product Type |
Key Item |
Now |
2011 |
2012 |
2013 |
Multilayer PCB(Rigid) |
Max Layer count |
40 |
40 |
40 |
40 |
Line width/spacing for inner layer(mil) |
2.5 / 2.5 |
2.5 / 2.5 |
2.0/2.0 |
2.0/2.0 |
Line width/spacing for outer layer(mil) |
2.5 / 2.5 |
2.5 / 2.5 |
2.0/2.0 |
2.0/2.0 |
Max Aspect Ratio |
22 :1 |
22 :1 |
24:1 |
26:1 |
Min Mechanical Drill size(mil) |
4 |
3 |
3 |
3 |
Min Spacing between via to Conductor(mil) |
5 |
4.8 |
4.5 |
4.5 |
HDI PCB |
1+C+1 |
M |
M |
M |
M |
2+C+2 |
P |
M |
M |
M |
3+C+3 |
R&D |
S |
S |
M |
ALIVH |
/ |
R&D |
R&D |
S |
Min laser drill size(mil) |
3 |
3 |
2.5 |
2 |
Min pad size of laser hole(mil) |
8 |
8 |
7.5 |
7 |
Max Aspect Ratio(laser hole) |
1.1:1 |
1.2:1 |
1.2:1 |
1.2:1 |
Rigid-Flex PCB |
Max Layer count |
20 |
26 |
30 |
40 |
Line width/spacing for inner layer(mil) |
3.5/3.5 |
3 / 3 |
2.5/2.5 |
2.5 / 2.5 |
Line width/spacing for outer layer(mil) |
3.5/3.5 |
3 / 3 |
2.5/2.5 |
2.5 / 2.5 |
Max Aspect Ratio |
10:1 |
12:1 |
16:1 |
16:1 |
Min Mechanical Drill size(mil) |
8 |
8 |
6 |
6 |
Min Spacing between via to Conductor(mil) |
7 |
7 |
6.5 |
6.5 |
Special Technics |
Metal based PCB |
aluminium& Copper |
aluminium& Copper |
aluminium& Copper |
aluminium& Copper |
Depth tolerance of Metal matrix(mm) |
±0.05 |
±0.03 |
±0.03 |
±0.03 |
Tolerance for depth controlled board(mm) |
±0.13 |
±0.10 |
±0.10 |
±0.10 |
Impedance Control |
7% |
7% |
5% |
5% |
Heavy Copper(OZ) |
10 |
10 |
10 |
10 |
Heatsink Board(The technology of press by No-flow PP) |
P |
M |
M |
M |
Heatsink Board(Sweat bonding) |
S&P |
M |
M |
M |
(DBC)PCB |
S&P |
M |
M |
M |
Embedded metal PCB |
R&D |
S&P |
M |
M |
Embedded capacitance PCB |
R&D |
M |
M |
M |
Embedded resistance PCB |
S&P |
S&P |
M |
M |
Local high frequency Circuit boards |
S&P |
M |
M |
M |
Microvia filling by plating |
S&P |
M |
M |
M |
Epoxy plugging (conductive/non-conductive) |
M |
M |
M |
M |
NOTE |
R&D: Research and development,S:Sample,
P:low volume production,M:Mass Production |