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Product Type Key Item Now 2011 2012 2013
Multilayer PCB(Rigid) Max Layer count 40 40 40 40
Line width/spacing for inner layer(mil) 2.5 / 2.5 2.5 / 2.5 2.0/2.0 2.0/2.0
Line width/spacing for outer layer(mil) 2.5 / 2.5 2.5 / 2.5 2.0/2.0 2.0/2.0
Max Aspect Ratio 22 :1 22 :1 24:1 26:1
Min Mechanical Drill size(mil) 4 3 3 3
Min Spacing between via to Conductor(mil) 5 4.8 4.5 4.5
HDI PCB 1+C+1 M M M M
2+C+2 P M M M
3+C+3 R&D S S M
ALIVH / R&D R&D S
Min laser drill size(mil) 3 3 2.5 2
Min pad size of laser hole(mil) 8 8 7.5 7
Max Aspect Ratio(laser hole) 1.1:1 1.2:1 1.2:1 1.2:1
Rigid-Flex PCB Max Layer count 20 26 30 40
Line width/spacing for inner layer(mil) 3.5/3.5 3 / 3 2.5/2.5 2.5 / 2.5
Line width/spacing for outer layer(mil) 3.5/3.5 3 / 3 2.5/2.5 2.5 / 2.5
Max Aspect Ratio 10:1 12:1 16:1 16:1
Min Mechanical Drill size(mil) 8 8 6 6
Min Spacing between via to Conductor(mil) 7 7 6.5 6.5
Special Technics Metal based PCB aluminium& Copper aluminium& Copper aluminium& Copper aluminium& Copper
Depth tolerance of Metal matrix(mm) ±0.05 ±0.03 ±0.03 ±0.03
Tolerance for depth controlled board(mm) ±0.13 ±0.10 ±0.10 ±0.10
Impedance Control 7% 7% 5% 5%
Heavy Copper(OZ) 10 10 10 10
Heatsink Board(The technology of press by No-flow PP) P M M M
Heatsink Board(Sweat bonding) S&P M M M
(DBC)PCB S&P M M M
Embedded metal PCB R&D S&P M M
Embedded capacitance PCB R&D M M M
Embedded resistance PCB S&P S&P M M
Local high frequency Circuit boards S&P M M M
Microvia filling by plating S&P M M M
Epoxy plugging (conductive/non-conductive) M M M M
NOTE R&D: Research and development,S:Sample,
P:low volume production,M:Mass Production

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