| Product Type | Key Item | Now | 2011 | 2012 | 2013 | 
                    
                        | Multilayer PCB(Rigid) | Max Layer count | 40 | 40 | 40 | 40 | 
                    
                        | Line width/spacing for inner layer(mil) | 2.5 / 2.5 | 2.5 / 2.5 | 2.0/2.0 | 2.0/2.0 | 
                    
                        | Line width/spacing for outer layer(mil) | 2.5 / 2.5 | 2.5 / 2.5 | 2.0/2.0 | 2.0/2.0 | 
                    
                        | Max Aspect Ratio | 22 :1 | 22 :1 | 24:1 | 26:1 | 
                    
                        | Min Mechanical Drill size(mil) | 4 | 3 | 3 | 3 | 
                    
                        | Min Spacing between via to Conductor(mil) | 5 | 4.8 | 4.5 | 4.5 | 
                    
                        | HDI PCB | 1+C+1 | M | M | M | M | 
                    
                        | 2+C+2 | P | M | M | M | 
                    
                        | 3+C+3 | R&D | S | S | M | 
                    
                        | ALIVH | / | R&D | R&D | S | 
                    
                        | Min laser drill size(mil) | 3 | 3 | 2.5 | 2 | 
                    
                        | Min pad size of laser hole(mil) | 8 | 8 | 7.5 | 7 | 
                    
                        | Max Aspect Ratio(laser hole) | 1.1:1 | 1.2:1 | 1.2:1 | 1.2:1 | 
                    
                        | Rigid-Flex PCB | Max Layer count | 20 | 26 | 30 | 40 | 
                    
                        | Line width/spacing for inner layer(mil) | 3.5/3.5 | 3 / 3 | 2.5/2.5 | 2.5 / 2.5 | 
                    
                        | Line width/spacing for outer layer(mil) | 3.5/3.5 | 3 / 3 | 2.5/2.5 | 2.5 / 2.5 | 
                    
                        | Max Aspect Ratio | 10:1 | 12:1 | 16:1 | 16:1 | 
                    
                        | Min Mechanical Drill size(mil) | 8 | 8 | 6 | 6 | 
                    
                        | Min Spacing between via to Conductor(mil) | 7 | 7 | 6.5 | 6.5 | 
                    
                        | Special Technics | Metal based PCB | aluminium& Copper | aluminium& Copper | aluminium& Copper | aluminium& Copper | 
                    
                        | Depth tolerance of Metal matrix(mm) | ±0.05 | ±0.03 | ±0.03 | ±0.03 | 
                    
                        | Tolerance for depth controlled board(mm) | ±0.13 | ±0.10 | ±0.10 | ±0.10 | 
                    
                        | Impedance Control | 7% | 7% | 5% | 5% | 
                    
                        | Heavy Copper(OZ) | 10 | 10 | 10 | 10 | 
                    
                        | Heatsink Board(The technology of press by No-flow PP) | P | M | M | M | 
                    
                        | Heatsink Board(Sweat bonding) | S&P | M | M | M | 
                    
                        | (DBC)PCB | S&P | M | M | M | 
                    
                        | Embedded metal PCB | R&D | S&P | M | M | 
                    
                        | Embedded capacitance PCB | R&D | M | M | M | 
                    
                        | Embedded resistance PCB | S&P | S&P | M | M | 
                    
                        | Local high frequency Circuit boards | S&P | M | M | M | 
                    
                        | Microvia filling by plating | S&P | M | M | M | 
                    
                        | Epoxy plugging (conductive/non-conductive) | M | M | M | M | 
                    
                        | NOTE | R&D: Research and development,S:Sample, P:low volume production,M:Mass Production
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