Design capacity

The highest rate of signal design: 28Gbps

Maximum design layers: layer 28

Minimum design pitch: 0.4mm BGA

Minimum design line width and line distance: 3 / 3MI

The smallest aperture: 3mil

The maximum number of Connection: 30000

The maximum Pin number: 40000

Design of PCB plate up to BGA number: 44

Signal integrity design: 28G + super high-speed signal integrity design ability

HDI design: buried blind hole, after the hole, embedding, buried resistance

FPC design: 20 layer rigid-flexible PCB

Design: DFM, DFA, DFx DFT, DFC

EMC design: the design through the FCC, CISPR, VCCI certification

RF&Digital mixed board design and analysis